Low-expansion, solvent-free polyurethane foam for thermal insulation boards.
Description
PRODUCT DESCRIPTION
Low-expansion, solvent-free polyurethane foam for thermal insulation boards.
PROPERTIES – APPLICATION FIELDS
Moisture-curing, solvent-free polyurethane foam with excellent adhesion to a variety of substrates (render, concrete, metal, etc.), great acoustic and thermal insulation properties, and resistance to moisture and aging. Suitable for bonding extruded or expanded polystyrene insulation boards. Gun-grade.
PRODUCT DESCRIPTION
Low-expansion, solvent-free polyurethane foam for thermal insulation boards.
PROPERTIES – APPLICATION FIELDS
Moisture-curing, solvent-free polyurethane foam with excellent adhesion to a variety of substrates (render, concrete, metal, etc.), great acoustic and thermal insulation properties, and resistance to moisture and aging. Suitable for bonding extruded or expanded polystyrene insulation boards. Gun-grade.
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