High-performance, solvent-free adhesive for rapid and strong bonding, Montage-W.
In stock
Description
PRODUCT DESCRIPTION
High-performance, solvent-free adhesive for rapid and strong bonding.
PROPERTIES – APPLICATION FIELDS
Used for bonding of materials to almost all absorbent substrates, e.g. wood, concrete, masonry, gypsum board, etc. No need for drilling, screwing or nailing. Suitable also for bonding polystyrene thermal insulation boards.
PRODUCT DESCRIPTION
High-performance, solvent-free adhesive for rapid and strong bonding.
PROPERTIES – APPLICATION FIELDS
Used for bonding of materials to almost all absorbent substrates, e.g. wood, concrete, masonry, gypsum board, etc. No need for drilling, screwing or nailing. Suitable also for bonding polystyrene thermal insulation boards.
- GET IN TOUCH
Interested in Our Products or Collaborating with Our Team?
Fill the form below to contact us and get your next project started!
